H-PIN® Technology

Plastronics developed a new series of high performance, compliant contacts to serve high volume applications that require reliable electrical, mechanical, and thermal interconnect with program enabling manufacturability.

The H-PIN® is a stamped contact with probe pin performance providing a robust contact solution for burn-in, programming, and system level applications.

High Volume Manufacturing


Utilizing high volume BeCu stamping technology, combined with a stainless steel spring for mechanical travel, the H-PIN® has a working range up to 0.7mm with a flat spring rate, can be utilized up to 15GHz with -1.0dB loss, carry up to 4 amps of current and withstand temperatures up to 200°C. Automation has been developed to assemble the contact pin onto a stamped lead frame. The lead frame may then be singulated for hand loading or left on the lead frame reel and placed into an automated loading system.


H-PIN® Applications

Sockets and Interconnects for high-volume applications, featuring highly compliant contact elements with excellent mechanical, thermal, and electrical characteristics is here.

For the burn-in, programming, and system-validation markets (or other markets) that require 10,000+ insertions and thousands of sockets, the options are limited. The solution: The H-PIN®.

H-PIN® Features and Benefits


The H-PIN® is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe and the ease of use and high volume manufacturability of a stamped contact. The H-PIN® serves applications without the typical compromises that are generally required when considering cost versus performance.

 

Features: Benefits:
0.40mm to 0.70mm Travel
Compliancy for Large Package Warpage
Flat Spring Rate
Stable Contact Resistance and Force
BeCu H-PIN®
Solid Beam Electrical Performance
Stainless Steel Core Spring
Compliancy at High Temperatures (180C+)
Bandwidth -1dB @ 15GHz
Correlated BI, System Evaluation and Test
Current Carrying Capacity
Reliable Power and Ground Contact
High Volume Stamping *
Stocked Inventory and Better Lead Time
Automated Pin Assembly *
High Volume Capacity and Quality Control
Reel-to-Reel Pin Insertion *
High Volume Capacity and Ease of Use

* Production Tours available upon request for qualified programs

H-PIN® Data
(Internal Testing – Results may vary per application)

MECHANICAL PROPERTIES:

Pitch:
0.50mm to 1.00mm
Full Travel:
0.40mm to 0.70mm
Operating Temperature:
-30ºC to +180ºC
Mechanical Life:    
100,000+ cycles

ELECTRICAL PROPERTIES:
(Full Report Available Upon Request)

Contact Resistance:
30mΩ to 40mΩ max
Current Rating:
2 amp to 4 amp (free air)
Bandwidth @ -1dB:
Up to 15.0 GHz

MATERIALS:
Stamped Contact:
BeCu, Au Plate
Spring:
SS, Au Plate

DESIGN OPTIONS:

  • Tip Styles: Conical, V-notch, U-notch
  • Mounting Styles: Compression or Through-hole

 

 



1.00mm H-PIN®
For Reference Only



0.80mm H-PIN®

For Reference Only



0.50mm H-PIN®

For Reference Only





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H-PinŽ Technology
U.S. Patent Number 7,025,602

The original open top ball grid array socket technology.
U.S. Patent Number 5,419,710.

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