Lead Tip Contacting
    (SSOP) Sockets


PRODUCT FEATURES:

  • True Zero Insertion Force (ZIF) Socket
  • Design simplicity
  • Optimal airflow during burn-in
  • Automated or manual loading
  • Timely delivery
  • Device probing and testing through open top design
  • Trapped contacts
  • Compact size

MATERIAL SPECIFICATIONS:

Contacts
Material: Beryllium-Copper
Plating: Nickel / Boron
Temperature Rating: 150°C
Solder Tail Section: 0.64 [0.025] x 0.20 [0.008]
Solder Tail Length: 3.43 [0.135]

Plastic Parts
Material: 40% Glass-Filled PPS
Temperature Rating: 175°C Continuous
Insulation Resistance: 1x1013 Ohms / Mil

Coil Springs
Material: Passivated S.S.
Temperature Rating: 290°C Continuous

Rivets
Material: Brass, Nickel Plated
Temperature Rating: 175°C Continuous

Normal Force
Range To Be Expected: 55 Grams / Contact

Life Cycling
Life To Be Expected: 25,000 Cycles

Cap Compression
Depends on Pin Count (Available By Request)

Electrical Tests
Resistance: Less Than 30 MilliOhms @ 10 mA

PRODUCT SPECIFICATIONS AND DIMENSIONS:

   
Pitch
Device Dimensions (in)
Socket Dimensions (in)
Part #
Pins
In.
mm.
Dim A
Dim B
Dim C
Dim D
Dim E
Dim F
P2120SO
20
0.0256
0.65
0.291
0.209
0.069
0.706
0.808
0.591
P2024SO
24
0.0250
0.64
0.155
0.342
0.064
0.636
0.742
0.590
P2124SO
24
0.0256
0.65
0.307
0.220
0.590
0.706
0.808
0.591
P2034SO
34
0.0400
1.02
0.300
0.710
0.100
0.806
1.120
0.590
P2036SO
36
0.0315
0.80
0.300
0.595
0.091
0.860
1.045
0.650
P2044SO
44
0.0315
0.80
0.300
0.720
0.097
0.860
1.170
0.650
P2048SO
48
0.0250
0.64
0.295
0.630
0.098
0.806
1.140
0.590
P2056SO
56
0.0250
0.64
0.295
0.730
0.098
0.806
1.140
0.590

DETAIL DRAWINGS



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H-Pin® Technology
U.S. Patent Number 7,025,602

The original open top ball grid array socket technology.
U.S. Patent Number 5,419,710.
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