Quad Flat Pack
    (QFP/TQFP) Sockets



PRODUCT DESCRIPTION:

The worlds only Pressure Mount QFP sockets! Save time and money with maintenance on burn-in boards.
Meets Jedec spec MS-026

Plastronics "R2" Surface Pressure Mount Product Specifications

Contact Element: BeCu
Contact Plating: Gold Plating
Plastic Material: PPS
Metal Components: Stainless Steel
Resistance: < 30 mili ohms
Inductance: average 3 nH
Life Cycle: > 5,000 insertions

PRODUCT SPECIFICATIONS AND DIMENSIONS:

Socket P/N
# Pins
Pitch (mm)
Body Size (mm)
Dim A
Dim B
Dim C
R2QP100A105
100
0.50
14 x 14
40.23
40.23
13.46
R2QP100A107
100
0.65
14 x 20
46.23
40.23
13.46
R2QP144A105
144
0.50
20 X 20
46.23
46.23
13.46
R2QP164A104
164
0.40
20 X 20
46.23
46.23
13.46
R2QP176B104
176
0.40
20 X 20
46.23
46.23
13.46
R2QP176A105
176
0.50
24 x 24
50.24
50.24
13.46
R2QP208A105
208
0.50
28 x 28
54.23
54.23
13.46

DETAIL DRAWINGS



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H-Pin® Technology
U.S. Patent Number 7,025,602

The original open top ball grid array socket technology.
U.S. Patent Number 5,419,710.

Copyright 1998-2008 Plastronics. All Rights Reserved.