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BCC / CSP / LPCC / MLF/
MLP / QFN / DR QFN Sockets
PRODUCT DESCRIPTION :
Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
SPECIFICATIONS (mm):
Available in .40 up to 2.54 mm pitch designs
Custom pitches down to .40 mm
Lidded and Open Top Sockets for 3 mm - 10 mm packages
Lidded Sockets for 10 - 16 mm packages
Center ground pin standard for all sockets
Optional copper heat slug available for high wattage devices
Sockets for over 160 different JEDEC standard footprints
MECHANICAL PROPERTIES:
Mounting Method to Board: Thru-hole Mount
Socket Operation: Clamshell lid; ZIF Open Top
Operating Temperature: -50ฐ C to +150ฐ C
Contact Force: 25 gf typical
Life Cycles: 5,000 Mechanical Cycles
PHYSICAL PROPERTIES:
Plastic Body: PPS
Contact Base Metal: BeCu
Contact Plating: Au over Ni
Center Pin Base Metal Brass; Cu optional
Center Pin Plating: Au
Springs, Torsion / Coil: Passivated S.S.
ELECTRICAL PROPERTIES:
Contact Resistance: 50 mOhms
Inductance: 3 nH
Current Rating: .5A with 30ฐC rise, 1.0A with 75ฐC rise
Volume Resistivity: 1 x 1015 Ohm-cm
Insulation Resistance: 560 V/mil
QFN OFFERINGS:
- Plastronics offers 500 sockets with a variety of options. Over 160 unique footprints listed below
- Check with the factory for current availability for Dual Row QFN sockets
- Check with the factory for custom designs for high power applications
Product Specifications and Dimensions
QFN Socket Listing of Unique Footprints
Only basic sockets of unique footprints are listed. Alternative options are available for most sockets, which may include: Custom depopulation, open-top body, heat slug, 1mm+ thick packages, etc.
**Please contact Plastronics or your local rep. for available options**
For a complete list of sockets, download here.
DETAIL DRAWINGS :
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