"LIVE BUG" loading sockets for
  Amkor VisionPak LCC

With image sensor and optical packaging applications exploding in today’s market, Plastronics is pleased to announce the addition of a new line of sockets designed to fit Amkor Technology’s VisionPak Ceramic Leadless Chip Carrier packages. Plastronics’ LCC sockets have been in use for test and burn-in since 1982 providing a low-cost, reliable test solution for manual and automatic loading. Offering the widest selection of LCC sockets in the world, Plastronics now adds 3 new socket options specifically designed for Amkor’s VisionPak packages. These sockets are designed for packages to be inserted "Live-Bug" with the glass top up, since access to the top may be required during test.

Plastronics Socket P/N Description File
P2028S-G Socket for 28-Pin Amkor VisionPak LCC
P2032S-B Socket for 32-Pin Amkor VisionPak LCC
P2048S-D Socket for 48-Pin Amkor VisionPak LCC

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H-Pin® Technology
U.S. Patent Number 7,025,602

The original open top ball grid array socket technology.
U.S. Patent Number 5,419,710.

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