Plastronics Product Families

Plastronics offers test and burn-in sockets for the all the latest packaged devices in hundreds of lead counts and body size options.  Fully automated assembly lines for major products such as BGA and QFN gives customers a high-quality, cost-effective socket solution with quick time-to-market.

BGA Sockets

For additional information on our
BGA sockets please click here.



Available in 0.50, 0.65, 0.75, 0.80,
1.00, 1.27, 1.50 mm Pitch BGA Sockets

 

BCC / CSP / LPCC / MLF /
MLP / QFN / DR QFN Sockets



Available in 0.40 up to 2.54 mm Pitches
QFN Fast Facts Sheet (PDF 540k)

Leadless Chip Carrier
(LCC) Sockets


Our LCC sockets are built standard for "Dead Bug" loading. Click here for "Live Bug" loading sockets for Amkor Technology's VisionPak® LCC devices.

 

 

Land Grid Array
(LGA) Sockets


1.27 mm Pitch Sockets

PLCC Sockets



1.27 mm Pitch Sockets

 

 


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H-Pin® Technology
U.S. Patent Number 7,025,602

The original open top ball grid array socket technology.
U.S. Patent Number 5,419,710.

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