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Plastronics Product Families

Plastronics offers test and burn-in sockets for the all the latest packaged devices in hundreds of lead counts and body size options. Fully automated assembly lines for major products such as BGA and QFN gives customers a high-quality, cost-effective socket solution with quick time-to-market.

BGA Sockets For additional information on our BGA sockets please click here. Available in 0.50, 0.65, 0.75, 0.80, 1.00, 1.27, 1.50 mm Pitch BGA Sockets		BCC / CSP / LPCC / MLF / MLP / QFN / DR QFN Sockets Available in 0.40 up to 2.54 mm Pitches
Lead Tip Contacting (SSOP) Sockets Available in 0.65, 0.64, 0.80, and 1.02 mm Pitches		Land Grid Array (LGA) Sockets 1.27 mm Pitch Sockets
Leadless Chip Carrier (LCC) Sockets Our LCC sockets are built standard for "Dead Bug" loading. Click here for "Live Bug" loading sockets for Amkor Technology's VisionPak® LCC devices.		PLCC Sockets 1.27 mm Pitch Sockets
Side Contacting (SO) Sockets 1.27 mm Pitch Sockets

H-Pin® Technology
U.S. Patent Number 7,025,602