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Open-top BGA
Sockets
Plastronics
currently offers the largest selection of Ball Grid Array
(BGA) sockets in the industry, with over 400 options including
0.50 mm, 0.75 mm, 0.80 mm, 1.0 mm, 1.27 mm and 1.5 mm pitch
sockets. All sockets can be modified to accept SuperBGA®,
Ceramic BGA, Metal BGA and many others, accepting package
sizes up to 50 mm depending on pitch. By eliminating the lid,
Plastronics' open-top sockets can accommodate virtually any
thickness BGA device with uniform, low contact resistance.
Using a cam handle or rocker (for automated loading / unloading),
Plastronics' open-top sockets provide true True Zero Insertion
Force (ZIF) Socket (ZIF) loading. All contact forces, regardless
of solder ball count, are contained within the socket and
are not transferred to the burn-in board. This eliminates
bowing and concurrent difficulty in contacting solder balls.
To make the BGA open-top sockets as cost-effective as possible,
Plastronics utilizes a system of "clip-in" guide plates on
the top surface of the socket. This enables the socket to
accept virtually any size package, of the same pitch, that
is equal to or smaller than the maximum allowable package
size. Custom "clip-in" guide plates are manufactured for a
minimal fee in a short amount of time, eliminating the high
tooling charges of a separate socket for each individual package.
The Benefits for BGA
True
True Zero Insertion Force (ZIF) Socket
Using
a cam handle or open top (for automated loading / unloading),
Plastronics’ Open-Top
BGA sockets provide True Zero Insertion Force (ZIF) Socket
loading. The zero insertion force Open-Top socket can
accommodate in excess of 1000 solder balls. All contact
forces, regardless of solder ball count, are contained
within the socket and are not transferred to the burn-in
board, eliminating bowing and concurrent difficulty in
contacting the solder balls.
Selectively
Depopulated
Plastronics can also selectively load any BGA socket with only the contact pins that are required. In addition to socket cost savings, burn-in and DUT board designs become easier, simpler and less expensive.
Largest available
BGA line in the industry
Current production includes 0.50 mm, 0.75
mm, 0.80 mm, 1.00 mm, 1.27 mm and 1.50 mm pitch sockets.
All sockets can be modified to accept SuperBGA®
devices, Ceramic
BGA, Metal BGA and many others. Lidded versions of the
27 mm and 43 mm are also available for special applications.
Package size of up to 50 mm can be accepted depending on
pitch.
Varying device thickness' are not a factor
By eliminating the lid on a BGA socket,
Plastronics’ Open-Top BGA sockets can accommodate virtually
any thickness BGA device, with uniform, low contact resistance.
Varying contact plating options
Offering various platings for our contacts
allows our customers to meet their unique individual needs.
Our standard contact plating is Gold with tin
lead plating on the tail section of the contact. We also
offer contact plating with Nickel Boron.
Optimal airflow during burn-in
Plastronics’ Open-Top BGA sockets provide
maximum air-flow, minimizing heat related damage to devices.
With burn-in temperatures as high as 150°C and electrical
currents running through the package, maximum convective
heat transfer is attained with the Open-Top socket.
Contact on upper hemisphere of the solder
ball
Plastronics’ patented contact touches
and ’wipes’ the solder ball on the upper hemisphere, eliminating
the possibility of unacceptable solder ball deformation
and related problems in package solderability. Patent No.
5,419,710.
Automated or manual loading
With vertical actuation force (open type style) or radial motion (cam handle), the choice is yours
for automated or manual loading of devices.
Cost-effective tooling for custom packages
Utilizing a system of “clip-in” guide
plates on the top surface of the socket, Plastronics’ Open-Top
BGA socket can accept virtually any size package (on the
same pitch) that is equal to or smaller than the maximum
allowable package size. This eliminates high tooling charges
for a separate socket for each individual package. Custom
‘clip-in’ guide plates are manufactured for a minimal fee,
in a short amount of time.
Timely delivery
Open-Top BGA sockets can be delivered
in as little as 2 weeks, with higher quantities and custom
guide plates in as little as 3-5 weeks.
BGA Design Functionality for >=1.0mm Pitch Sockets
BGA Socket
Information
MATERIAL SPECIFICATIONS:
Contacts
| Material |
S.S. |
| Standard
Plating |
30
µin/PdNi |
| Optional |
30
µin/NiB
30 µin/Au |
| Temperature
Rating |
300°C |
Solder Tail Section
| Pitch
1.0, 1.27, 1.5 |
0.36
mm x 0.13mm |
| Pitch
0.80 |
0.20mm
x 0.13mm |
| Solder
Tail Length |
27mm
Base = 3.86mm |
| Solder
Tail Length |
43mm
Base = 3.30mm |
| Solder
Tail Length |
50mm
Base = 3.43mm |
Plastic Parts
| Material |
40%
Glass-Filled PPS |
| Temperature
Rating |
175°C
Continuous |
| Insulation
Resistance |
1x1013
Ohms/Mil |
Mounting Hardware, Cam Handle, Spring
| Material |
S.S. |
| Temperature
Rating |
300°C
Continuous |
ELECTRICAL TESTS
| Resistance
(Ambient)* |
<
25 MilliOhms |
| Resistance
(160°C) |
50
MilliOhms (Max) |
| Capacitance |
0.234
pF (1Mhz) |
| Inductance |
4
nH |
| Frequency
Response |
Avg.
Insertion Loss At 500 Mhz
Is -0.52dB |
| * HP 4328 A Milliohmmeter |
VIBRATION
| Equipment |
Fluke
Data Bucket
Techtronix Oscilloscope |
| Procedure |
40
Random Contacts
Daisy-Chained Biased At 10 Volts |
| Test |
5
Cycles In X,Y,Z Axis
Linear Sweep 10-500 Hz
1 Minute Up - 1 Down
.050" Displacement, 10-53 Hz
Continuing at 10G, 53-500 Hz |
| Results |
^Resistance
Was Negligible |
NORMAL FORCE
- 44 - 48 Grams With 0.03mm - 0.05mm Wipe
LIFE CYCLING
- Life To Be Expected: 5,000 Cycles plus
SOLDER BALL DEFORMATION
- Through a patented contact method, no scratching or deforming
will occur on the reflow portion of the solder ball.
- Testing for 240+ hours at 125°C has shown minimal impressions
of 0.03mm to 0.08mm at point of contact.
Installation
of Cam Handle BGA Socket onto
Burn-in Board or Printed Circuit Boar
INSTALLATION OF BGA SOCKET
TO BIB OR PCB
STEP ONE
If Black Contact Protector / PCB Guide Plate
on bottomside of the socket is not extended, gently pull it
down or firmly tap socket on flat surface until the guide
plate is flush with the bottom of the contact tails. Avoid
touching the grid area of the socket while extending the PCB
guide plate flush with the contact tails.
STEP TWO
Insert the locating pins on the Black Contact
Protector/PCB Guide Plate into their matching holes on the
PCB.
STEP THREE
Gently and evenly press down on the socket until it is seated
on the BIB or PCB.
STEP FOUR
Locate the four socket screws on the backside
of the BIB or PCB.Use the mounting hardware, consisting of
four (4) Nylatron washers, four (4) flat washers, four (4)
lock washers, and four (4) hex nuts, in that order, to secure
the socket to the PCB or BIB. It is important that the Nylatron
washer is mounted next to the PCB or BIB.
STEP FIVE
Gently tighten the hex nut until the split
lock washers are compressed. However, if the split lock washers
are difficult to see, one to two (1-2) inch/lbs of torque
will be sufficient. Be cautious not to overtighten the hex
nuts or damage to the BIB or PCB may occur.
STEP SIX
Rotate the cam handle or rocker cam to the open position
before soldering contacts.
STEP SEVEN
Solder.
STEP EIGHT
Remove labels from the top of the socket.
LOADING THE PACKAGE INTO SOCKET
STEP ONE
Rotate the cam handle or rocker arm to the
open position. If the contacts are not open when loading,
damage will occur to the tips of the contacts. The rocker
arm closest to the end of the socket should be down, or the
cam handle vertical.
STEP TWO
Place the package with the correct predetermined
orientation into the socket. Confirm that the package is properly
seated by gently pressing on all four corners of the package.
STEP THREE
Rotate the cam handle or rocker arm to the
closed position. Do not apply any pressure to the top of the
package while closing the contacts. If pressure is applied,
it is possible solder mask will be scraped onto the contact,
causing an insulation barrier at the solder ball. If this
does occur, clean the contacts with a vacuum brush.
UNLOADING THE PACKAGE
STEP ONE
Rotate the cam handle or rocker arm to the
open position. The cam handle should be in a vertical position
and very little force is needed to rotate the cam handle.
Over extension could break the camming mechanism, so do not
force the cam past the vertical stopping position. The rocker
arm will naturally stop at the surface of the BIB or PCB.
STEP TWO
Unload the package using vertical force.
PREVENTIVE MAINTENANCE
Depending on frequency of use and the burn-in
environment, the sockets should be inspected for accumulation
of debris or solder material on the contacts or in the cavities.
On regular intervals the socket should be vacuum brushed to
remove these materials.
In addition, the contacts might be contaminated
or bent if touched by human fingers. Care should be exercised
during operation, storage, and inspection to prevent any contact.
For removal of solder accumulation or tin/lead
on the contact tips, a citric acid wash solution can be used
and will not harm the socket or contacts.
OTHER ISSUES
Opens during testing: Remove the package
and do one of the following:
- Vacuum brush the contacts and socket.
- Inspect the socket’s contacts to see if any are bent or
contaminated.
- Replace the package without pressing down on the package
when actuating the cam lever or rocker arm.
REMOVAL OF PACKAGE GUIDE PLATES
The sockets have snap-on guide plates on
the top surface that are fitted to the size of the specific
BGA package. Attempting to remove these could result in their
breaking. If for any reason removal of these plates is necessary,
e.g. to allow a test gauge to fit, please call Plastronics
at 1-800-582-5822 for instructions. If the guide plates do
break, do not replace them into the socket. Call Plastronics
for replacements or instructions.
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0.50 mm Pitch Sockets
