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.75
mm Pitch BGA Sockets
PRODUCT
DESCRIPTION:
Plastronics
now offers .75 mm pitch test and burn-in sockets for fine
pitch BGA and CSP packages. Witness marks on tested packages
show excellent contact with the small solder balls associated
with CSP packages while maintaining no deformation on the
lower 50% of the solder ball.
SPECIFICATIONS (mm):
•
Up to 10 x 19 Matrix
• Grid Array Pitch .75 x .75
• Max IC Size 10.20 x 20.0
• Solder Ball Size: .30 +/- .05
.35 +/-
.05
.45 +/- .05
• Cover Actuation Force 1.19 Kg (avg.)
MECHANICAL PROPERTIES:
• Mounting Method to Board: Thru-hole
Mount
• Socket Operation: ZIF (Push cover 3 mm stroke)
• Operating Temperature: -65°C to +150°C
• Contact Force: 10+/- 3 gf
• Life Cycles: 10,000 Mechanical Cycles
PHYSICAL PROPERTIES:
•
Plastic Body: PEI
• Plastic Grid Plates: PEI
• Contact Base Metal: BeCu
• Contact Plating: Au over Ni
ELECTRICAL
PROPERTIES:
•
Contact Resistance: < 50 mOhm
• Inductance: < 6 nH
• Capacitance: < 2.59 pF
• Current Rating: 1A
• Volume Resistivity: 1,000 MOhm @ 100 VDC
•
Insulation Resistance: 100 VAC for 1 minute
DETAIL
DRAWINGS:
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