|
.65
mm Pitch BGA Sockets
PRODUCT
DESCRIPTION:
Plastronics now offers .65 mm pitch test and burn-in sockets for
fine pitch BGA and CSP packages. This socket can accept packages
up to 18 x 18 mm and a maximum 25 x 25 ball matrix. Plastronics’
BGA sockets can be selectively loaded with only the exact number of
pins required for a cost-effective burn-in solution.
SPECIFICATIONS (mm):
•
Up to 25 x 25 Matrix
• Grid Array Pitch .65 x .65
• Max IC Size 18.00 x 18.00
• Solder Ball Sizes .30 +/- .05
.40 +/- .05
• Cover Actuation Force 1.19 Kg (avg.)
MECHANICAL PROPERTIES:
• Mounting Method to Board: Thru-hole Mount
• Socket Operation: ZIF (Push cover 3 mm stroke)
• Operating Temperature: -65°C to +150°C
• Contact Force: 10+/- 3 gf
• Life Cycles: 20,000 Mechanical Cycles
PHYSICAL PROPERTIES:
•
Plastic Body: PEI
• Plastic Grid Plates: PEI
• Contact Base Metal: BeCu
• Contact Plating: Au over Ni
ELECTRICAL
PROPERTIES:
•
Contact Resistance: < 50 mOhm
• Inductance: < 6 nH
• Capacitance: < 2.59 pF
• Current Rating: 1A
• Volume Resistivity: 1,000 MOhm @ 100 VDC
•
Insulation Resistance: 100 VAC for 1 minute
DETAIL
DRAWINGS:
Go
back to Open-top BGA Sockets
|
