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.50 mm Pitch
BGA Sockets
PRODUCT
DESCRIPTION:
Plastronics
now offers .50 mm pitch test and burn-in sockets for fine
pitch BGA and CSP packages. These sockets show
excellent contact with the small solder balls associated with
CSP packages while maintaining no deformation on the lower
50% of the solder ball.
SPECIFICATIONS (mm):
• Up to 20 x 20 Matrix
• Grid Array Pitch .50 x .50
• Max IC Size 11.5 x 18.0
• Solder Ball Size .30 +/- .05 (Call for information
on additional sizes.)
• Cover Actuation Force 1.19 Kg (avg.)
MECHANICAL PROPERTIES:
• Mounting Method to Board: Thru-hole
Mount
• Socket Operation: ZIF (Push cover 3 mm stroke)
• Operating Temperature: -65°C to +150°C
• Contact Force: 10+/- 3 gf
• Life Cycles: 10,000 Mechanical Cycles
PHYSICAL PROPERTIES:
• Plastic Body PEI
• Plastic Grid Plates PEI
• Contact Base Metal BeCu
• Contact Plating Au over Ni
ELECTRICAL
PROPERTIES:
•Contact
Resistance < 50 mOhm
• Inductance < 6 nH
• Capacitance < 2.59 pF
• Current Rating 1A
• Volume Resistivity 1,000 MOhm @ 100 VDC
DETAIL
DRAWINGS:
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back to Open-top BGA Sockets
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