Plastronics - LGA Sockets, LGA Socket, LGA Test Socket, LGA Test Sockets, LGA Burn-in Socket, LGA burn-in Sockets, LGA Test Burn-in Socket, LGA Test Burn-in Sockets, Land Grid Array Socket, Land Grid Array Sockets

Land Grid Array (LGA)
Sockets

PRODUCT FEATURES:

Automated or manual loading
Timely delivery
Cost-effective tooling for custom packages
Surface mountable sockets are also available

MATERIAL SPECIFICATIONS:

Contacts
Material: S.S.
Plating: 30ľin / PdNi
Optional: 30ľin / NiB or 30ľin / Aľ Temperature Rating: 300°C
Solder Tail Section: 0.36 mm x 0.13 mm

Plastic Parts
Material: 40% Glass-Filled PPS
Temperature Rating: 175°C Continuous Simulation Resistance: 1x10¹³ Ohms / Mil

Mounting Hardware, Cam Handle, Spring
Material: S.S.
Spring Rate: 4.8 lbs / in [0.086 kg / mm]
Temperature Rating: 300°C Continuous

PRODUCT SPECIFICATIONS AND DIMENSIONS:

Surface Mount 31 mm Format Sockets / 1.27 mm Pitch
Socket Dimensions

Pitch

Pin Count

Part Number

Body Size

Matrix

Description

A

B

C

1.27

575

575LG12B131

31 X 31

24 X 24

Surface Mount

57.81

47.45

22.31

DETAIL DRAWINGS

H-Pin® Technology
U.S. Patent Number 7,025,602