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Plastronics has just announced the release of a new open-top .50 mm pitch BGA socket solution and a new line of Open-Top QFN style sockets for Q3, 2003!

The new .50 mm pitch BGA socket can accept packages up to a 20 x 20 ball matrix and incorporates dual “pinch” style gold plated BeCu contacts that engage the solder balls on their upper hemisphere. Tests up to 175° C have proven minimal ball deformation and consistent resistance levels below 50 mOhms.

The new Open-Top QFN socket utilizes the internal pieces of over 130 currently available lidded QFN socket options offered by Plastronics, thus allowing customers to now choose between lidded or open-top solutions. The socket features microminiature contact elements, and a center ground/thermal pin.