Corporate Overview

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Plastronics was founded over 30 years ago for the exclusive purpose of designing, manufacturing and marketing high-quality burn-in sockets. With corporate offices located in Irving, Texas and a manufacturing facility in Grand Prarie Texas, Plastronics' mission is simple: "Provide quality, cost-effective socket solutions to meet the harsh demands of the burn-in test market."

As semiconductor devices become more complicated and their packaging becomes smaller and more intricate, the need for supporting infrastructure, delivered in a timely manner, becomes more crucial. Plastronics employs a full in-house design and engineering development team who continually work to develop socket solutions for the next generation of packaged semiconductor devices. As the original inventor of the open-top surface mount device socket and the open-top Ball Grid Array (BGA) socket, Plastronics is committed to continue development of new contact methods to meet higher frequency devices packaged in tighter pitch configurations.

Once a new socket solution has been designed, Plastronics can move the product immediately into production at its own manufacturing facility. By designing and producing all injection molding tools in-house, Plastronics is able to offer its customers quick time-to-market solutions for test and burn-in sockets for the latest packaged devices and assurance that the new socket has passed stringent in-house inspection processes. When the product is ready for production, Plastronics offers a state-of-the-art, fully automated assembly line for all major product lines thus giving customers a high-quality, cost effective socket solution for years to come.

Being one of the first socket manufacturers to design and develop a socket solution for BGA packages, Plastronics holds a patent on a special contact method that touches and "wipes" the solder ball on the upper hemisphere. This eliminates the possibility of unacceptable solder ball deformation and related problems in package solderability. (Patent No. 5,419,710).

Having supported the burn-in test market for over 30 years, Plastronics offers a full line of quality sockets for BGA, QFN, LCC, PLCC, SO, SSOP and LGA packages. Plastronics has sales and support representatives across the U.S. ready to answer your questions and provide quotes for socket solutions that meet your needs.

If you need a quotation, product drawings, or any additional information on our products, please contact us.

Plastronics is always looking for qualified people in the test and burn-in area. For current careers, click here.

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H-Pin® Technology
U.S. Patent Number 7,025,602

The original open top ball grid array socket technology.
U.S. Patent Number 5,419,710.

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